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# 👋 Hi, I'm Verdvana
**Senior ASICs Engineer @ Qualcomm**
[](https://www.google.com/maps/search/Qualcomm+Shanghai)
[](mailto:verdvana@outlook.com)
[](https://github.com/Verdvana)
*Expert in Digital IC Design, FPGA/MCU Development, and Hardware Innovation.*
💼 Work Experience
Qualcomm (Shanghai) Co., Ltd.
Senior ASICs Engineering Engineer |
2023.12 - PresentASICs Engineering Engineer |2021.06 - 2023.12ASICs Engineering Intern |2020.06 - 2020.09
- Leading and contributing to complex digital design and verification flows.
山西中谷科技股份有限公司
Hardware Engineer |
2018.04 - 2018.08
- Focused on industrial-grade hardware design and low-power systems.
🛠 Technical Skills
| Domain | Tools & Languages |
|---|---|
| ASIC Design |         |
| FPGA Dev |     |
| Hardware |     |
| MCU/Emb |     |
🚀 Engineering Projects
-
微波智能感知平台 2019.03-2021.04 -
消防员辅助监控系统 2018.11-2019.07 - 基于FPGA的多通道流量及温度检测系统
2019.10-2019.12 -
基于FPGA的圆形光电探测阵列数据采集系统
2018.10-2019.05 
低功耗甲烷检测系统 2018.06-2018.08-
单总线多点温度检测器 2018.04-2018.07 -
带频谱显示的音频播放器 2016.10-2017.06 -
总线型温室大棚监控系统 2016.09-2016.11 -
带啸叫检测与抑制的功率放大电路
2016.06-2016.09 
风力摆 2015.06-2015.09
🎓 Education
-
西安电子科技大学 (Xidian University) 2018.09 - 2021.06- Master of Electronic and Communication Engineering
-
中北大学 (North University of China) 2013.09 - 2017.07- Bachelor of Electronic Science and Technology
