Career
2023.12 — Present
2021.06 — 2023.12
Qualcomm (Shanghai) Co., Ltd.
Senior ASICs Engineer
ASICs Engineer
Led RTL design and subsystem integration for Wi‑Fi 6/7/8 SoCs at Qualcomm Shanghai, contributing to 10+ successful tape‑outs across multiple FastConnect platforms.
Worked closely with architecture and power teams to implement low‑power features at RTL level.
Developed Tcl/Perl automation tools to significantly accelerate STA sign‑off and timing closure efficiency.
Featured Projects
FastConnect 8800 6nm
Next-gen Wi-Fi 8 flagship with ultra-wide 320 MHz bandwidth, UWB integration, and 4K QAM modulation.
FastConnect 8700 14nm
High-bandwidth Wi-Fi 8 solution with advanced low-power Hearable BT subsystem (HBS).
FastConnect 7800 6nm/14nm
Multi-link Wi-Fi 7 platform with dual Bluetooth architecture and cutting-edge RF design.
FastConnect 7700 14nm
Cost-optimized Wi-Fi 7 chip delivering flagship features in a compact, low-power design.
FastConnect 6400 22nm
Entry-level Wi-Fi 6 SoC with efficient 2×2 MIMO, targeting IoT and mobile platforms.
2018.04 — 2018.08
Shanxi Zhonggu Technology
Hardware Engineer
Developed low-power industrial sensor systems and high-precision multi-layer PCB designs.
Verilog
Perl
Tcl
Python
VCS
OrCAD Capture
Altium Designer
KiCAD
Multisim
C
Vivado
Quartus Prime
ModelSim
Keil MDK
Proteus