Verdvana — ASICs & FPGA & MCU & Hardware Design

Career

2021.06 — Present

Senior ASICs Engineer

Senior ASICs Engineer (2023.12 — Present)
Leading hardware development for next-generation silicon architectures, focusing on efficiency and high-performance design.

ASICs Engineer (2021.06 — 2023.12)
Contributed to complex IC design verification and implementation workflows.

Featured Projects

FastConnect 8800 6nm

Wi-Fi 8 (802.11bn) Bluetooth 7.0 11.6 Gbps Peak 4×4 Wi-Fi UWB & Thread 4k QAM & 320MHz BW

FastConnect 8700 14nm

Wi-Fi 8 (802.11bn) Bluetooth 7.0 8.6 Gbps Peak Low Power HBS

FastConnect 7800 6nm/14nm

Wi-Fi 7 (802.11be) Bluetooth 5.4 5.8 Gbps Peak Dual Bluetooth 4k QAM & 320MHz BW

FastConnect 7700 14nm

Wi-Fi 7 (802.11be) Bluetooth 5.4 5.8 Gbps Peak Low Power 4k QAM & 320MHz BW

FastConnect 6400 22nm

Wi-Fi 6 (802.11ax) Bluetooth 5.2 1.2 Gbps Peak 2x2 MIMO 1024 QAM

2018.04 — 2018.08

Hardware Engineer

Shanxi Zhonggu Technology

Focused on PCB design and low-level hardware development for industrial sensors.

Featured Projects

低功耗甲烷检测系统 STM32L0

Low Power Sch/PCB Design Embedded C

单总线多点温度检测器 STM8L15

IIC Bus Sch/PCB Design Embedded C

Education

2018.09 — 2021.06

M.E. in Electronics and Communication Engineering

Xidian University

Focused on advanced digital signal processing and hardware architecture during postgraduate studies.

2013.09 — 2017.07

B.E. in Electronic Science and Technology

North University of China

Foundational studies in semiconductor physics, circuit design, and embedded systems.

Engineering the
Future of Silicon.

Career

Senior ASICs Engineer

Featured Projects

FastConnect 8800 6nm

FastConnect 8700 14nm

FastConnect 7800 6nm/14nm

FastConnect 7700 14nm

FastConnect 6400 22nm

Hardware Engineer

Featured Projects

低功耗甲烷检测系统 STM32L0

单总线多点温度检测器 STM8L15

Education

M.E. in Electronics and Communication Engineering

B.E. in Electronic Science and Technology

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